Established in 2000, Comchip strives to become the leading global semiconductor solution provider, delivering solutions and support with cost and quality advantages. Based in Taiwan, Comchip is constantly expanding in key locations around the world to provide direct, superior customer service, with sales offices located in China, Silicon Valley and New York.

 

With innovative research and patented manufacturing capabilities, Comchip offers products including bridge rectifiers, fast efficient rectifiers, switching diodes, Zener diodes, Schottky diodes, TVS and ESD surge protectors. Recent expansion of product offering also includes power semiconductor devices including transistor and MOSFET solutions. Comchip products cover a vast array of applications in the electronics industry including lighting, automotive, industrial computers, TFT-LCD panels, network/telecom, medical, and consumer electronics. To ensure superior quality and reliability, Comchip’s in-house labs and production facilities are aligned with current automotive industry requirements in accordance with industry standards including AEC-Q101, TS16949, ISO9001, and ISO14001.

  • 2001 Completion of ISO9001 certification .
  • 2002 Product design process technology established.
  • 2003 Completion of 10th patent application.
  • 2004 Completion of DFN-type chip diodes design, entering volume production.
  • 2005 Became the largest domestic chip diode manufacturer in Taiwan. Entering design and development of other discrete semiconductor components.
  • 2006 Cumulated total of 24 completed patent technology applications, and achieved a cumulative total of 14 patent certificates .
  • 2007 Completion of SOD-723 package design, entering volume production. The package size is the most compact small-signal diode packaging at the time.
  • 2008 Completion of SOD-923 package design, entering volume production .
  • 2009 Completion of the first generation SOT-383 (Array Diodes) design, entering volume production .
  • 2010 Completion of SOT-23-3 design, entering volume production .
  • 2011 Completion of SOT-23-5 & SOT-23-6 design, entering volume production .
  • 2011 Completion of SOD-523 thin package design, entering volume production .
  • 2012 Completion of SOD-123 design, entering volume production .
  • 2013 Completion of TS16949 certification.
  • 2013 Lab compliance with AEC-Q101 standard for Automotive grade diodes.
  • 2014 Completion of SOD-882 (Copper substrate) design, entering volume production.
  • 2015 Completion of DFN2510 ESD array, entering volume production. Certified by Ford Motor Company, successfully entered their American automotive supply chain.
  • 2016 Completion of super thin SOD-123ST (height <0.5mm) design, the thinnest SOD-123 technology in the market.Certified by BMW, successfully entered their European automotive supply chain.
  • 2017 Completion of DFN1010 design, entering volume production.Certified by Tesla Motors, successfully entered their electric vehicle supply chain.
  • 2018 Developed the Wafer Level Chip Scale Process (WLCSP), completion of ESD and Schottky device in micro package DFN0402 (01005) mass production.Certified by Volkswagen, successfully entered their automotive supply chain.