□ 2001 Completion of ISO9001 certification .

□ 2002 Product design process technology established.

□ 2003 Completion of 10th patent application.

□ 2004 Completion of DFN-type chip diodes design, entering volume production.

□ 2005 Became the largest domestic chip diode manufacturer in Taiwan. Entering design and development of other discrete semiconductor components.

□ 2006 Cumulated total of 24 completed patent technology applications, and achieved a cumulative total of 14 patent certificates .

□ 2007 Completion of SOD-723 package design, entering volume production. The package size is the most compact small-signal diode packaging at the time.

□ 2008 Completion of SOD-923 package design, entering volume production .

□ 2009 Completion of the first generation SOT-383 (Array Diodes) design, entering volume production .

□ 2010 Completion of SOT-23-3 design, entering volume production .

□ 2011 Completion of SOT-23-5 & SOT-23-6 design, entering volume production .

□ 2011 Completion of SOD-523 thin package design, entering volume production .

□ 2012 Completion of SOD-123 design, entering volume production .

□ 2013 Completion of TS16949 certification.

□ 2013 Lab compliance with AEC-Q101 standard for Automotive grade diodes.

□ 2014 Completion of SOD-882 (Copper substrate) design, entering volume production.