2024.03.22

Comchip Product Launch Event 2024

Comchip Product Launch Event 2024

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At its 2024 product launch event, Comchip Technology introduced a new form of packaging innovation—“Chip-Level Stacked Passive Component Structure Packaging Technology.” This breakthrough significantly enhances the performance of discrete components and addresses operational challenges associated with miniaturized devices.


In 2024, Comchip Technology announced a new line of passive discrete components.