Yingge District, New Taipei City — On April 25, 2025, Comchip Technology Co., Ltd. hosted its annual product launch event, introducing a series of high-performance discrete components designed for miniaturization, high power density, and low forward voltage drop. The event drew industry partners and media representatives, highlighting Comchip’s innovation capabilities and global presence in the power semiconductor sector.

“Our design philosophy centers on miniaturization, efficiency, and reliability,” said Ms. Yun-Yun Sung, General Manager of Comchip Technology. “We remain committed to helping customers worldwide achieve more stable and flexible power and protection designs across diverse electronic applications.”

Key product highlights include:

WLCSP-packaged Schottky diodes:

Featuring ultra-low forward voltage, ideal for space-constrained designs.

High-power, compact TVS protection devices:

Combining high surge absorption with miniaturized form factors to enhance transient protection in automotive and communication modules.

Ultra-miniature MOSFET series:

Built with DFN0201 packaging, tailored for mobile and compact electronic devices.

ISO 17025-certified lab initiative:

Plans underway to establish an ESD protection solution lab meeting ISO 17025 standards, offering comprehensive component validation and application support.

Comchip also showcased its latest reference design platforms and packaging technologies, helping customers accelerate development cycles and improve system integration. Looking ahead, Comchip will continue expanding its product portfolio and deepening its leadership in the discrete component domain.